Wurth Elektronik Thermal Gap Pad, 11.5 mm Thick, 1800 W/mK, 15 mm, 15mm, Acrylic and Graphite

RS Stock No.:: 242-0179
Distrelec Article No.:: 302-53-117
Mfr. Part No.:: 407150015115
Brand:: Wurth Elektronik

Wurth Elektronik Thermal Gap Pad, 11.5 mm Thick, 1800 W/mK, 15 mm, 15mm, Acrylic and Graphite

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Subtotal (1 unit)*

$3.64

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$4.00

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In Stock

Plus 70 unit(s) shipping from 19 October 2026
Plus 175 unit(s) shipping from 23 November 2026

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Units	Per unit
1 - 4	$3.64
5 - 9	$3.46
10 +	$3.28

*price indicative

RS Stock No.:: 242-0179
Distrelec Article No.:: 302-53-117
Mfr. Part No.:: 407150015115
Brand:: Wurth Elektronik

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Wurth Elektronik
	Product Type	Thermal Gap Pad
	Thickness	11.5mm
	Thermal Conductivity	1800W/mK
	Conductive Material	Acrylic and Graphite
	Width	15mm
	Standards/Approvals	RoHS
	Length	15mm
	Colour	Black
	Maximum Operating Temperature	120°C
	Minimum Operating Temperature	-40°C

	Select all
	Brand Wurth Elektronik
	Product Type Thermal Gap Pad
	Thickness 11.5mm
	Thermal Conductivity 1800W/mK
	Conductive Material Acrylic and Graphite
	Width 15mm
	Standards/Approvals RoHS
	Length 15mm
	Colour Black
	Maximum Operating Temperature 120°C
	Minimum Operating Temperature -40°C

Wurth Elektronik Thermal Gap Pad, 11.5mm Thickness, Black - 407150015115

This thermal gap pad provides a compliant Interface for transferring heat between components while filling uneven gaps in assemblies. It is formulated from acrylic combined with graphite to support thermal management across a range of temperatures, and is suited to electronic systems requiring a soft, conductive filler that conforms to mating surfaces.

Features and Benefits:

• 1800W/mK thermal conductivity for efficient heat transfer
• Operates from -40°C to 120°C for broad-temperature use
• Acrylic and graphite composition for conformable contact
• RoHS approval reduces hazardous substance concerns

Applications

• Suitable for bridging thermal gaps in power modules
• Ideal for heat dissipation in Compact electronic assemblies
• Used with heatsinks where uneven surfaces occur
• Can be used as a thermal Interface material for electronics requiring gap filling