Wurth Elektronik WE-TGFG Series Thermal Gap Pad, 5 mm Thick, 1800 W/mK, 15 mm, 15mm, Acrylic and Graphite

This thermal gap pad provides a compliant Interface for conducting heat between components and heat sinks in electronic assemblies. It combines acrylic binder with graphite filler to deliver enhanced thermal transfer while remaining electrically non-conductive through the bulk material. The product is supplied in a Compact black format suitable for confined spaces and operates across a broad temperature range for use in varied thermal environments.

• 1800W/mK thermal conductivity reduces junction temperatures
• Acrylic and graphite composition enables efficient heat flow
• Wide operating temperature range maintains performance across conditions
• RoHS conformity supports use in regulated electronic designs
• Black colour aids Visual identification during assembly

• Suitable for thermal management of LED modules
• Used with Power Semiconductors requiring gap filling
• Ideal for Compact electronic cooling assemblies
• Can be used for Interface between PCBs and chassis
• Used for heat dissipation in consumer electronic devices

The pad is supplied in a 15 x 15mm footprint with a 5mm profile to fill typical Air gaps.

The acrylic binder combined with graphite provides a high-conductivity path while retaining conformability for surface irregularities.

It functions across a minimum of -40°C up to a maximum of 120°C.