Molex 70543 Series Vertical Through Hole Header, 3 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

N

Subtotal (1 tube of 250 units)*

$468.47

(exc. GST)

$515.32

(inc. GST)

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Tube(s)
Per Tube
Per unit*
1 +$468.47$1.874

*price indicative

RS Stock No.:
691-307
Mfr. Part No.:
70543-0107
Brand:
Molex
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Brand

Molex

Product Type

Header

Series

70543

Pitch

2.54mm

Current

3A

Number of Contacts

3

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Material

Brass and Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-40°C

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex SL Header is a high-quality connector designed for reliable wire-to-board applications. Featuring a 2.54mm pitch and a robust single-row design, this vertical header accommodates three circuits for effective signal transmission. The product is constructed with high-temperature thermoplastic and features selective gold plating on the mating surfaces, ensuring durability and optimal electrical performance. Its versatile design is suitable for a broad range of PCB headers and receptacles, making it an Ideal choice for various electronic applications. The SL Header is also engineered for easy assembly with its through-hole termination interface, ensuring secure connections.

Constructed with high-temperature thermoplastic for enhanced durability

Selective gold plating minimises oxidation for optimal electrical performance

Vertical orientation designed for efficient space utilisation on PCBs

Durability rated for up to 50 mating cycles, ensuring long-lasting use

3.0A maximum current per contact supports varied electronic applications

Locking mechanism secures mating connections and reduces the risk of disconnection

Shrouded design for improved alignment and protection against accidental disengagement

Perfect for use in applications requiring signal transmission with reliability and efficiency

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