Quectel BG770AGLAA-N06-SGNSA RF Module 4.8V
- RS Stock No.:
- 225-1587P
- Mfr. Part No.:
- BG770AGLAA-N06-SGNSA
- Brand:
- Quectel
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 225-1587P
- Mfr. Part No.:
- BG770AGLAA-N06-SGNSA
- Brand:
- Quectel
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Quectel | |
| Sub Type | Energy Module | |
| Product Type | RF Module | |
| Component Type | Module, Module | |
| Maximum RF Data Rate | 1119kbps | |
| Maximum Output Power | 21dBm | |
| Mount Type | Surface | |
| Interface Type | UART, USB | |
| Minimum Supply Voltage | 2.6V | |
| Maximum Supply Voltage | 4.8V | |
| Minimum Operating Temperature | -35°C | |
| Maximum Operating Temperature | 75°C | |
| Length | 14.9mm | |
| Height | 1.7mm | |
| Series | BG77 | |
| Width | 12.9mm | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Quectel | ||
Sub Type Energy Module | ||
Product Type RF Module | ||
Component Type Module, Module | ||
Maximum RF Data Rate 1119kbps | ||
Maximum Output Power 21dBm | ||
Mount Type Surface | ||
Interface Type UART, USB | ||
Minimum Supply Voltage 2.6V | ||
Maximum Supply Voltage 4.8V | ||
Minimum Operating Temperature -35°C | ||
Maximum Operating Temperature 75°C | ||
Length 14.9mm | ||
Height 1.7mm | ||
Series BG77 | ||
Width 12.9mm | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- CN
The Quectel ultra-compact LPWA module supporting LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is fully compliant with 3GPP Rel-14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor. Its Advanced LGA package allows fully automated manufacturing for high-volume applications.
Robust mounting and interfaces
Supports USB 2.0 Interface
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