Amphenol Communications Solutions 100-Way IDC Connector Male for Surface, 10 Row
- RS Stock No.:
- 182-3116
- Mfr. Part No.:
- 84512-102LF
- Brand:
- Amphenol Communications Solutions
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- RS Stock No.:
- 182-3116
- Mfr. Part No.:
- 84512-102LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Product Type | IDC Connector | |
| Number of Contacts | 100 | |
| Number of Rows | 10 | |
| Current | 450mA | |
| Pitch | 1.27mm | |
| Voltage | 200V ac | |
| Mount Type | Surface | |
| Shrouded/Unshrouded | Shrouded | |
| Connector Gender | Male | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -65.0°C | |
| Termination Type | Solder | |
| Series | Meg-Array | |
| Maximum Operating Temperature | 105.0°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Contact Material | Copper | |
| Housing Material | Liquid Crystal Polymer | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Product Type IDC Connector | ||
Number of Contacts 100 | ||
Number of Rows 10 | ||
Current 450mA | ||
Pitch 1.27mm | ||
Voltage 200V ac | ||
Mount Type Surface | ||
Shrouded/Unshrouded Shrouded | ||
Connector Gender Male | ||
Contact Plating Gold | ||
Minimum Operating Temperature -65.0°C | ||
Termination Type Solder | ||
Series Meg-Array | ||
Maximum Operating Temperature 105.0°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Contact Material Copper | ||
Housing Material Liquid Crystal Polymer | ||
- COO (Country of Origin):
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
100 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
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