- RS Stock No.:
- 182-2937
- Mfr. Part No.:
- 84512-102LF
- Brand:
- Amphenol Communications Solutions
500 In Global stock for delivery within 10 working day(s)
Added
Price (ex. GST) Each (On a Reel of 250)
$27.171
(exc. GST)
$29.888
(inc. GST)
Units | Per unit | Per Reel* |
250 - 250 | $27.171 | $6,792.75 |
500 - 750 | $26.492 | $6,623.00 |
1000 + | $26.085 | $6,521.25 |
*price indicative |
- RS Stock No.:
- 182-2937
- Mfr. Part No.:
- 84512-102LF
- Brand:
- Amphenol Communications Solutions
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
100 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Specifications
Attribute | Value |
---|---|
Number of Contacts | 100 |
Number of Rows | 10 |
Gender | Male |
Pitch | 1.27mm |
Mounting Type | Surface Mount |
Termination Method | Solder |
Current Rating | 450mA |
Contact Plating | Gold |
Series | Meg-Array |
Minimum Operating Temperature | -40.0°C |
Maximum Operating Temperature | 85.0°C |
Voltage Rating | 200.0 V ac |
Contact Material | Copper |
Housing Material | LCP |
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