Amphenol ICC, MEG-Array® 32Gb/s High Density BGA Connector 1.27 mm Pitch Plug Connector, 9 Column, 81 Way
- RS Stock No.:
- 795-509
- Mfr. Part No.:
- 55714-202LF
- Brand:
- Amphenol ICC
N
Subtotal (1 reel of 250 units)*
$17,413.05
(exc. GST)
$19,154.36
(inc. GST)
FREE delivery for orders over $80.00 ex GST
Stocked by manufacturer
- Ready to ship from 10 December 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | $17,413.05 | $69.652 |
*price indicative
- RS Stock No.:
- 795-509
- Mfr. Part No.:
- 55714-202LF
- Brand:
- Amphenol ICC
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | Plug Connector | |
| Number of Contacts | 81 | |
| Current | 0.45A | |
| Number of Columns | 9 | |
| Voltage | 200V ac | |
| Housing Material | Liquid Crystal Polymer | |
| Pitch | 1.27mm | |
| Mount Type | Surface | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL (E66906) | |
| Series | MEG-Array® 32Gb/s High Density BGA Connector | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type Plug Connector | ||
Number of Contacts 81 | ||
Current 0.45A | ||
Number of Columns 9 | ||
Voltage 200V ac | ||
Housing Material Liquid Crystal Polymer | ||
Pitch 1.27mm | ||
Mount Type Surface | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL (E66906) | ||
Series MEG-Array® 32Gb/s High Density BGA Connector | ||
- COO (Country of Origin):
- US
The Amphenol ICC connector offers a high-density solution is designed for reliable data transmission. It supports flexible ground distribution, ensuring optimal high-speed signal integrity at speeds of up to 32 Gbps, Ideal for various applications.
Patented BGA design enhances self-levelling and self-cantering capabilities
Durability guarantees proven solder joint reliability exceeding 22 years
Available stack heights range from 4mm to 14mm for diverse applications
Supports varying pin counts from 40 to 528 positions
Integrates multiple in-process Vision systems for assured contact integrity
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