Infineon TLE75080ESHXUMA1 High Side 2, High Side Power Switch IC 24-Pin, TSDSO
- RS Stock No.:
- 223-8600
- Mfr. Part No.:
- TLE75080ESHXUMA1
- Brand:
- Infineon
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- RS Stock No.:
- 223-8600
- Mfr. Part No.:
- TLE75080ESHXUMA1
- Brand:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Power Switch Topology | High Side | |
| Power Switch Type | High Side | |
| Product Type | Power Switch IC | |
| Switch On Resistance RdsOn | 2.2Ω | |
| Number of Outputs | 8 | |
| Number of Inputs | 2 | |
| Interface Type | SPI | |
| Mount Type | Surface | |
| Minimum Supply Voltage | 3V | |
| Package Type | TSDSO | |
| Pin Count | 24 | |
| Maximum Supply Voltage | 28V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 150°C | |
| Operating Current | 330mA | |
| Height | 1.15mm | |
| Width | 6mm | |
| Length | 8.65mm | |
| Standards/Approvals | No | |
| Series | SPIDER | |
| Automotive Standard | AEC | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Power Switch Topology High Side | ||
Power Switch Type High Side | ||
Product Type Power Switch IC | ||
Switch On Resistance RdsOn 2.2Ω | ||
Number of Outputs 8 | ||
Number of Inputs 2 | ||
Interface Type SPI | ||
Mount Type Surface | ||
Minimum Supply Voltage 3V | ||
Package Type TSDSO | ||
Pin Count 24 | ||
Maximum Supply Voltage 28V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 150°C | ||
Operating Current 330mA | ||
Height 1.15mm | ||
Width 6mm | ||
Length 8.65mm | ||
Standards/Approvals No | ||
Series SPIDER | ||
Automotive Standard AEC | ||
Infineon SPIDER Series Power Switch IC, 28V Maximum Supply Voltage, 24 Pin Count - TLE75080ESHXUMA1
This power switch IC is a high-side automotive power distribution device designed for SPI control in vehicle systems. It offers multiple controlled outputs for switching loads within a 3-28V supply range and is intended for surface-mounted installation in automotive-grade applications operating across a broad temperature range.
Features and Benefits:
• 8 outputs delivering centralised load switching capability
• SPI Interface enabling serial control of outputs
• 2.2Ω low RdsOn reducing conduction losses
• 0.33A operating current suitable for moderate loads
• AEC automotive qualification for vehicle-grade deployment
• -40 to150°C rated operation for extreme environments
• SPI Interface enabling serial control of outputs
• 2.2Ω low RdsOn reducing conduction losses
• 0.33A operating current suitable for moderate loads
• AEC automotive qualification for vehicle-grade deployment
• -40 to150°C rated operation for extreme environments
Applications
• Suitable for decentralised body control modules
• Ideal for multiplexed lighting and signalling systems
• Used for controlled switching in power distribution units
• Can be used for fan or pump load management
• Used with microcontrollers for gated power sequencing
• Ideal for multiplexed lighting and signalling systems
• Used for controlled switching in power distribution units
• Can be used for fan or pump load management
• Used with microcontrollers for gated power sequencing
How many control inputs are provided for monitoring or control?
It incorporates two inputs that can be used for external sensing or control signalling.
What is the package pin count and mounting style?
The device is supplied in a 24-pin TSD SO package intended for surface-mount assembly.
What are the physical height and footprint constraints for PCB layout?
The component has a height of 1.15 mm and a footprint measuring 8.65 x 6 mm, aiding Compact board designs.
What topology does the device use for switching and thermal performance?
It employs a high-side switch topology compatible with automotive power architectures and supports high operating temperatures.
What supply voltage limits should be observed during design?
Design should accommodate a minimum supply of 3 V and a maximum supply of 28 V when integrating the device.