Infineon Single HEXFET 1 Type N-Channel MOSFET, 162 A, 40 V Enhancement, 3-Pin I2PAK IRF1404LPBF

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RS Stock No.:
913-3815
Mfr. Part No.:
IRF1404LPBF
Brand:
Infineon
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Brand

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

162A

Maximum Drain Source Voltage Vds

40V

Package Type

I2PAK (TO-262)

Series

HEXFET

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

4mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

-20/20 V

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

175°C

Transistor Configuration

Single

Width

4.83 mm

Length

10.67mm

Height

9.65mm

Number of Elements per Chip

1

COO (Country of Origin):
MX

Infineon HEXFET Series MOSFET, 162A Maximum Continuous Drain Current, 3.8W Maximum Power Dissipation - IRF1404LPBF


This MOSFET provides an efficient solution in various electronic applications, particularly where high performance is essential. Its Advanced processing techniques make it suitable for automation and electronic control systems, contributing to modern power management devices.

Features & Benefits


• Delivers a continuous drain current of 162A for robust performance

• Withstands a maximum drain-source voltage of 40V for safe operation

• Exhibits low on-resistance (RDS(on)) of 4 mΩ, enhancing energy efficiency

• Utilises enhancement mode technology for improved switching performance

• Supports through-hole mounting, facilitating integration into existing designs

Applications


• Used in high current circuits for power regulation

• Suitable for power supply designs in industrial automation

• Applied in electric motor drives and control systems

• Ideal for DC-DC converters in renewable energy systems

What is the maximum power dissipation capability?


It can handle power dissipation up to 3.8W under specific conditions, ensuring optimal performance without overheating during operation.

Is it compatible with surface mount designs?


While primarily in the I2PAK package for through-hole applications, it can be integrated into other industrial designs requiring robust components.

How should it be mounted for optimal performance?


Follow proper through-hole mounting techniques to ensure secure soldering, preventing thermal and mechanical failures during operation.

What are the implications of exceeding the specified limits?


Exceeding the continuous drain current or voltage limits may cause thermal overload or permanent damage to the device, affecting overall system reliability.

Can this component be reused after installation?


Reinstallation is possible if careful removal techniques are employed, though repeated thermal cycling may impact long-term reliability.

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