Vishay Type N-Channel MOSFET, 4.8 A, 200 V, 3-Pin TO-252 IRFR220PBF

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Subtotal (1 pack of 10 units)*

$8.04

(exc. GST)

$8.84

(inc. GST)

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Per Pack*
10 - 10$0.804$8.04
20 - 40$0.787$7.87
50 - 90$0.77$7.70
100 - 490$0.616$6.16
500 +$0.486$4.86

*price indicative

Packaging Options:
RS Stock No.:
256-7309
Mfr. Part No.:
IRFR220PBF
Brand:
Vishay
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Brand

Vishay

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

4.8A

Maximum Drain Source Voltage Vds

200V

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

0.1Ω

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

42W

Maximum Operating Temperature

175°C

Standards/Approvals

No

Height

2.39mm

Automotive Standard

No

Vishay IRFR220 Series Power MOSFET, 200V Maximum Drain Source Voltage, 4.8A Maximum Continuous Drain Current - IRFR220PBF


This power MOSFET is a surface-mount, N-channel switching device designed for high-voltage power-control tasks in industrial and electronic systems. It operates across a broad temperature range and is intended for applications requiring moderate continuous current handling and elevated drain-source voltage tolerance. The component is supplied in a Compact TO-252 package suitable for automated PCB assembly.

Features and Benefits:


• 200V maximum drain-source voltage provides high-voltage switching capability • 4.8A continuous drain current supports moderate load currents • 0.8Ω drain-source resistance reduces conduction losses under load • 42W maximum power dissipation allows sustained power handling • 14nC typical gate charge enables Faster gate-drive switching • ±150°C maximum operating temperature rating extends thermal margin

Applications


• Suitable for industrial motor-control driver stages • Ideal for high-voltage DC-DC converter switches • Used for power switching in automation actuators • Can be used for load switching in electrical test equipment

What gate-drive constraints should I observe for reliable switching?


Keep gate-source voltage within ±20V and design gate drivers to charge the gate with approximately 14nC to meet switching-speed expectations while avoiding overstress.

How does thermal performance affect PCB layout choices?


With a 42W dissipation limit, use adequate copper area, thermal vias and heat-sinking strategies on the board to spread heat from the TO-252 tab and maintain device junction temperature within rated limits.

What environmental limits are relevant to long-term operation?


The device is rated from -55°C to +150°C for operation, so component selection and system thermal design must ensure junction and ambient temperatures remain inside this range.

What mounting considerations are required for reliability?


The surface-mount TO-252 format needs correct solder fillet formation and reflow profiles to secure mechanical attachment and ensure low thermal resistance to the PCB.

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