Infineon F4-11MR12W2M1H_B70 Type N-Channel MOSFET, 60 A, 1200 V Enhancement F411MR12W2M1HPB76BPSA1
- RS Stock No.:
- 349-250
- Mfr. Part No.:
- F411MR12W2M1HPB76BPSA1
- Brand:
- Infineon
Subtotal (1 unit)*
$615.97
(exc. GST)
$677.57
(inc. GST)
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In Stock
- Plus 18 unit(s) shipping from 29 December 2025
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Units | Per unit |
|---|---|
| 1 + | $615.97 |
*price indicative
- RS Stock No.:
- 349-250
- Mfr. Part No.:
- F411MR12W2M1HPB76BPSA1
- Brand:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 60A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Series | F4-11MR12W2M1H_B70 | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 23.1mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Source Voltage Vgs | 23 V | |
| Maximum Power Dissipation Pd | 20mW | |
| Forward Voltage Vf | 5.35V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | 60749, IEC 60747, 60068 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 60A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Series F4-11MR12W2M1H_B70 | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 23.1mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Source Voltage Vgs 23 V | ||
Maximum Power Dissipation Pd 20mW | ||
Forward Voltage Vf 5.35V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals 60749, IEC 60747, 60068 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon EasyPACK 2B CoolSiC MOSFET fourpack module 1200 V, 11 mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology. This MOSFET features best-in-class packaging with a compact 12 mm height, ensuring optimal performance while saving space. It utilizes leading-edge Wide Bandgap materials, enhancing power efficiency and thermal management. The design boasts very low module stray inductance, reducing power losses and improving switching speed.
Outstanding module efficiency
System cost advantages
System efficiency improvement
Reduced cooling requirements
Enabling higher frequency
Increase of power density
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