Vishay SISS5208DN Type N-Channel Single MOSFETs, 172 A, 20 V Enhancement, 8-Pin PowerPAK
- RS Stock No.:
- 653-149
- Mfr. Part No.:
- SISS5208DN-T1-GE3
- Brand:
- Vishay
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| 25 - 99 | $1.90 |
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| 500 - 999 | $1.58 |
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*price indicative
- RS Stock No.:
- 653-149
- Mfr. Part No.:
- SISS5208DN-T1-GE3
- Brand:
- Vishay
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Product Type | Single MOSFETs | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 172A | |
| Maximum Drain Source Voltage Vds | 20V | |
| Package Type | PowerPAK | |
| Series | SISS5208DN | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 0.0013Ω | |
| Channel Mode | Enhancement | |
| Maximum Gate Source Voltage Vgs | 8V | |
| Typical Gate Charge Qg @ Vgs | 24.6nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 56.8W | |
| Forward Voltage Vf | 1.1V | |
| Maximum Operating Temperature | 150°C | |
| Height | 0.83mm | |
| Standards/Approvals | RoHS | |
| Length | 3.40mm | |
| Width | 3.40mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Product Type Single MOSFETs | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 172A | ||
Maximum Drain Source Voltage Vds 20V | ||
Package Type PowerPAK | ||
Series SISS5208DN | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 0.0013Ω | ||
Channel Mode Enhancement | ||
Maximum Gate Source Voltage Vgs 8V | ||
Typical Gate Charge Qg @ Vgs 24.6nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 56.8W | ||
Forward Voltage Vf 1.1V | ||
Maximum Operating Temperature 150°C | ||
Height 0.83mm | ||
Standards/Approvals RoHS | ||
Length 3.40mm | ||
Width 3.40mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
Vishay SISS5208DN Series Single MOSFETs, 20V Maximum Drain Source Voltage, 172A Maximum Continuous Drain Current - SISS5208DN-T1-GE3
Features and Benefits:
Applications
What gate voltage range should I plan for in gate-driver design?
How does the package affect PCB layout and thermal paths?
What ambient conditions are permissible for reliable operation?
How should inrush or transient currents be considered in design?
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