Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, TSOP to DIP
- RS Stock No.:
- 741-9397
- Mfr. Part No.:
- W9524RC
- Brand:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
$103.36
(exc. GST)
$113.695
(inc. GST)
Add 5 units to get free delivery
In Stock
- 50 unit(s) ready to ship from another location
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Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 370 | $20.672 | $103.36 |
| 375 - 1995 | $20.41 | $102.05 |
| 2000 + | $19.78 | $98.90 |
*price indicative
- RS Stock No.:
- 741-9397
- Mfr. Part No.:
- W9524RC
- Brand:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | TSOP | |
| Connection Gender A | Female | |
| Number of Contacts A | 14 | |
| Number of Contacts B | 14 | |
| Connection Gender B | Male | |
| Contact Plating | Tin over Nickel | |
| Connection B | DIP | |
| Series | SOP-DIP Iss5 | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Contact Material | Brass | |
| Standards/Approvals | No | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A TSOP | ||
Connection Gender A Female | ||
Number of Contacts A 14 | ||
Number of Contacts B 14 | ||
Connection Gender B Male | ||
Contact Plating Tin over Nickel | ||
Connection B DIP | ||
Series SOP-DIP Iss5 | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Contact Material Brass | ||
Standards/Approvals No | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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