Winslow Straight Surface Mount Mount 7.62 mm Pitch IC Socket Adapter, DIP to SOJ/SOP
- RS Stock No.:
- 240-6624
- Mfr. Part No.:
- W9540PRC
- Brand:
- Winslow
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Subtotal (1 unit)*
$87.59
(exc. GST)
$96.35
(inc. GST)
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- Shipping from 13 April 2026
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Units | Per unit |
|---|---|
| 1 - 24 | $87.59 |
| 25 - 99 | $86.05 |
| 100 + | $82.27 |
*price indicative
- RS Stock No.:
- 240-6624
- Mfr. Part No.:
- W9540PRC
- Brand:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | DIP | |
| Connection Gender A | Female | |
| Number of Contacts A | 20 | |
| Number of Contacts B | 20 | |
| Connection Gender B | Male | |
| Pitch | 7.62mm | |
| Connection B | SOJ/SOP | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Surface Mount | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Beryllium Copper Alloy | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A DIP | ||
Connection Gender A Female | ||
Number of Contacts A 20 | ||
Number of Contacts B 20 | ||
Connection Gender B Male | ||
Pitch 7.62mm | ||
Connection B SOJ/SOP | ||
Contact Plating Tin over Nickel | ||
Mount Type Surface Mount | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Beryllium Copper Alloy | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
DIP to SOIC Sockets
Two piece ’Adaptics’ that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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