Fischer Elektronik Heatsink, Universal Square Alu, 18.5K/W 10 mm 27 mm 27mm
- RS Stock No.:
- 674-4759
- Mfr. Part No.:
- ICK BGA 27x27x10
- Brand:
- Fischer Elektronik
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$4.44
(exc. GST)
$4.88
(inc. GST)
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In Stock
- Plus 397 unit(s) shipping from 21 September 2026
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Units | Per unit |
|---|---|
| 1 - 49 | $4.44 |
| 50 - 99 | $4.41 |
| 100 - 249 | $4.28 |
| 250 + | $4.09 |
*price indicative
- RS Stock No.:
- 674-4759
- Mfr. Part No.:
- ICK BGA 27x27x10
- Brand:
- Fischer Elektronik
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 27mm | |
| Width | 27mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw | |
| Thermal Resistance | 18.5K/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Application | Pin Heat Sinks, Heat Sink For Pentium III/Xeon, Heat Sink For Microprocessor, Fan, Cooler, Heat Sink For Dil and Ic, Heat Sink For Pentium Pro, Semiconductor, SMD, Heat Sink For Ic Processor, Heat Sink For PLCC, Heat Sink For Power PC, Heatsink for PGA, Heat Sink For Bga | |
| Material | Aluminium | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 27mm | ||
Width 27mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw | ||
Thermal Resistance 18.5K/W | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Application Pin Heat Sinks, Heat Sink For Pentium III/Xeon, Heat Sink For Microprocessor, Fan, Cooler, Heat Sink For Dil and Ic, Heat Sink For Pentium Pro, Semiconductor, SMD, Heat Sink For Ic Processor, Heat Sink For PLCC, Heat Sink For Power PC, Heatsink for PGA, Heat Sink For Bga | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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