Heatsink, Universal Square Alu, 18.5K/W, 27 x 27 x 10mm, Adhesive Foil, Conductive Foil

RS Stock No.:: 674-4759
Mfr. Part No.:: ICK BGA 27x27x10
Brand:: Fischer Elektronik

Heatsink, Universal Square Alu, 18.5K/W, 27 x 27 x 10mm, Adhesive Foil, Conductive Foil

90 In Global stock for delivery within 10 working day(s)

Price (ex. GST) Each

$3.38

(exc. GST)

$3.72

(inc. GST)

Units	Per unit
1 - 49	$3.38
50 - 99	$3.35
100 - 249	$3.25
250 +	$3.10

RS Stock No.:: 674-4759
Mfr. Part No.:: ICK BGA 27x27x10
Brand:: Fischer Elektronik

Technical data sheets

Heatsinks for IC Processor Data Sheet

Legislation and Compliance

COO (Country of Origin):: DE

Product Details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks

Specifications

Attribute	Value
For Use With	Universal Square Alu
Length	27mm
Width	27mm
Height	10mm
Dimensions	27 x 27 x 10mm
Thermal Resistance	18.5K/W
Mounting	Adhesive Foil, Conductive Foil
Colour	Black
Material	Aluminium
Package Type	BGA