Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Adhesive Foil, Conductive Foil

RS Stock No.:: 674-4747
Mfr. Part No.:: ICK BGA 10x10x10
Brand:: Fischer Elektronik

Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Adhesive Foil, Conductive Foil

76 In AU stock for next working day delivery

245 In Global stock for delivery within 5 working day(s)

110 In Global stock for delivery within 10 working day(s)

Added

Price (ex. GST) Each

$4.11

(exc. GST)

$4.52

(inc. GST)

Units	Per unit
1 - 49	$4.11
50 - 99	$4.09
100 - 249	$3.94
250 +	$3.78

RS Stock No.:: 674-4747
Mfr. Part No.:: ICK BGA 10x10x10
Brand:: Fischer Elektronik

Technical data sheets

Heatsinks for IC Processor Data Sheet

Legislation and Compliance

COO (Country of Origin):: DE

Product Details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks

Specifications

Attribute	Value
For Use With	Universal Square Alu
Length	10mm
Width	10mm
Height	10mm
Dimensions	10 x 10 x 10mm
Thermal Resistance	28.5K/W
Mounting	Adhesive Foil, Conductive Foil
Colour	Black
Material	Aluminium
Package Type	BGA