Arcol Ohmite Heatsink, TO-247 and TO-264 Devices 38.61 mm 55.12 mm 31.5 mm
- RS Stock No.:
- 227-5405
- Mfr. Part No.:
- PV-T21-38E
- Brand:
- Arcol Ohmite
This image is representative of the product range
Bulk discount available
Subtotal (1 unit)*
$9.22
(exc. GST)
$10.14
(inc. GST)
FREE delivery for orders over $60.00 ex GST
Being discontinued
- Final 8 unit(s), ready to ship from another location
Units | Per unit |
|---|---|
| 1 - 39 | $9.22 |
| 40 - 79 | $9.00 |
| 80 + | $8.87 |
*price indicative
- RS Stock No.:
- 227-5405
- Mfr. Part No.:
- PV-T21-38E
- Brand:
- Arcol Ohmite
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Arcol Ohmite | |
| Product Type | Heatsink | |
| For Use With | TO-247 and TO-264 Devices | |
| Length | 55.12mm | |
| Width | 31.5 mm | |
| Height | 38.61mm | |
| Fastening | Vertical | |
| Diameter | 0.105 in | |
| Series | P | |
| Finish | Degreased | |
| Compatible Package Type | TO-247, TO-264, TO-22 | |
| Standards/Approvals | No | |
| Application | Cooling | |
| Surface Area | 14823mm² | |
| Select all | ||
|---|---|---|
Brand Arcol Ohmite | ||
Product Type Heatsink | ||
For Use With TO-247 and TO-264 Devices | ||
Length 55.12mm | ||
Width 31.5 mm | ||
Height 38.61mm | ||
Fastening Vertical | ||
Diameter 0.105 in | ||
Series P | ||
Finish Degreased | ||
Compatible Package Type TO-247, TO-264, TO-22 | ||
Standards/Approvals No | ||
Application Cooling | ||
Surface Area 14823mm² | ||
- COO (Country of Origin):
- CN
The Arcol Ohmite Heatsink P series forged pin-fin heatsink (Pat. Pending). The P series heat sinks offer an all-in-one solution combining a compact design with a universal cam clip system for TO-220, TO-247, TO-264 package devices. TO-220 devices can be attached using non-standard cam clips. This powerful forged pin heatsink is designed to be thru-hole soldered to the PCB board. The forged pin design allows forced convection cooling in multiple directions.
Larger surface area creating minimum thermal flow impedance
Ideal type of heat sink for high power and small size (1U or 2U) electronic packaging with natural and forced convection cooling
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