50 Ω STMicroelectronics PCB Chip Balun
- RS Stock No.:
- 239-6241
- Mfr. Part No.:
- BALF-SPI2-01D3
- Brand:
- STMicroelectronics
This image is representative of the product range
Bulk discount available
View bulk pricing optionsSubtotal (1 reel of 5000 units)*
$2,250.00
(exc. GST)
$2,500.00
(inc. GST)
FREE delivery for orders over $60.00 ex GST
Temporarily out of stock
- Shipping from 24 August 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
|---|---|---|
| 5000 - 20000 | $0.45 | $2,250.00 |
| 25000 + | $0.435 | $2,175.00 |
*price indicative
- RS Stock No.:
- 239-6241
- Mfr. Part No.:
- BALF-SPI2-01D3
- Brand:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Chip Balun | |
| Balance Impedance | 50Ω | |
| Maximum Insertion Loss | 2.1dB | |
| Mount Type | PCB | |
| Pin Count | 6 | |
| Maximum Frequency | 930MHz | |
| Minimum Frequency | 860MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Width | 1.6mm | |
| Height | 0.68mm | |
| Series | BALF | |
| Length | 2.15mm | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Chip Balun | ||
Balance Impedance 50Ω | ||
Maximum Insertion Loss 2.1dB | ||
Mount Type PCB | ||
Pin Count 6 | ||
Maximum Frequency 930MHz | ||
Minimum Frequency 860MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Width 1.6mm | ||
Height 0.68mm | ||
Series BALF | ||
Length 2.15mm | ||
The STMicroelectronics ultra-miniature balun uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance. It integrates matching network and harmonics filter.
50 Ω nominal input
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint
Very low profile < 620 μm after reflow
High RF performance
RF BOM and area reduction
ECOPACK2 compliant component
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