onsemi DF6A6.8FUT1G 4-Element Uni-Directional ESD Protection Diode, 75 W, 6-Pin SC-88

This image is representative of the product range

Bulk discount available

Subtotal (1 pack of 25 units)*

$5.875

(exc. GST)

$6.45

(inc. GST)

Add to Basket
Select or type quantity
Stock information currently inaccessible - Please check back later

Units
Per unit
Per Pack*
25 - 725$0.235$5.88
750 - 1475$0.233$5.83
1500 +$0.226$5.65

*price indicative

Packaging Options:
RS Stock No.:
186-9729
Mfr. Part No.:
DF6A6.8FUT1G
Brand:
onsemi
Find similar products by selecting one or more attributes.
Select all

Brand

onsemi

Diode Configuration

Array

Product Type

ESD Protection Diode

Direction Type

Uni-Directional

Minimum Breakdown Voltage Vbr

6.4V

Mount Type

Surface

Package Type

SC-88

Maximum Reverse Stand-off Voltage Vwm

5V

Pin Count

6

Peak Pulse Power Dissipation Pppm

75W

ESD Protection

Yes

Test Current It

5mA

Minimum Operating Temperature

-55°C

Number of Elements per Chip

4

Maximum Operating Temperature

150°C

Height

1mm

Length

2.2mm

Standards/Approvals

No

Maximum Reverse Leakage Current

1μA

Automotive Standard

AEC-Q101

This quad voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium.

SC-88 Package Allows Four Separate Unidirectional Configurations

Low Leakage < 1 μ A @ 5 Volt

Breakdown Voltage: 6.4 - 7.2 Volt @ 5 mA

Low Capacitance (40 pF typical)

ESD Protection Meeting 61000-4-2 Level 4 and 16 kV Human Body Model

Mechanical Characteristics:

Void Free, Transfer-Molded, Thermosetting Plastic Case

Corrosion Resistant Finish, Easily Solderable

Package Designed for Optimal Automated Board Assembly

Small Package Size for High Density Applications

Related links