Vishay 33 μF Surface Polymer Capacitor, 4V dc

RS Stock No.:: 173-0453
Mfr. Part No.:: T55B336M004C0200
Brand:: Vishay

Vishay 33 μF Surface Polymer Capacitor, 4V dc

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Bulk discount available

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Subtotal (1 reel of 2000 units)*

$1,036.00

(exc. GST)

$1,140.00

(inc. GST)

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Units	Per unit	Per Reel*
2000 - 2000	$0.518	$1,036.00
4000 - 6000	$0.505	$1,010.00
8000 +	$0.498	$996.00

*price indicative

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RS Stock No.:: 173-0453
Mfr. Part No.:: T55B336M004C0200
Brand:: Vishay

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Vishay
	Technology	Polymer
	Product Type	Polymer Capacitor
	Capacitance	33μF
	Voltage	4V dc
	Mount Type	Surface
	Package/Case	3528-21
	Polarity	Polar
	Tolerance	±20 %
	Maximum Operating Temperature	105°C
	Dimensions	3.5 x 2.8 x 1.9 mm
	Length	3.5mm
	Depth	2.8mm
	Series	T55
	Height	1.9mm
	Better World Product	Yes
	Electrolyte Type	Solid
	Better World Claim	Designed to Optimise Safety
	Minimum Operating Temperature	-55°C
	Ripple Current	700mA
	Leakage Current	13.2μA
	Automotive Standard	No
	Dissipation Factor	10%

	Select all
	Brand Vishay
	Technology Polymer
	Product Type Polymer Capacitor
	Capacitance 33μF
	Voltage 4V dc
	Mount Type Surface
	Package/Case 3528-21
	Polarity Polar
	Tolerance ±20 %
	Maximum Operating Temperature 105°C
	Dimensions 3.5 x 2.8 x 1.9 mm
	Length 3.5mm
	Depth 2.8mm
	Series T55
	Height 1.9mm
	Better World Product Yes
	Electrolyte Type Solid
	Better World Claim Designed to Optimise Safety
	Minimum Operating Temperature -55°C
	Ripple Current 700mA
	Leakage Current 13.2μA
	Automotive Standard No
	Dissipation Factor 10%

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors

Moulded Case, High Performance Polymer Type

Ultra-low ESR

Moulded case available in 5 case codes

Terminations: Cases J, P, and A: 100 % tin

Cases B and T: Ni/Pd/Au

Compatible with high volume automatic pick and place equipment

Moisture sensitivity level 3

Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets