Molex Micro-Fit Series Right Angle Through Hole PCB Header, 12 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 205-1067
- Mfr. Part No.:
- 212528-1200
- Brand:
- Molex
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- RS Stock No.:
- 205-1067
- Mfr. Part No.:
- 212528-1200
- Brand:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Housing Material | LCP | |
| Number of Contacts | 12 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 600V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series Micro-Fit | ||
Pitch 3mm | ||
Current 12.5A | ||
Housing Material LCP | ||
Number of Contacts 12 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Row Pitch 3mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 600V | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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