RS PRO Heatsink, Universal Rectangular Alu, 2.5kΩ/W 25 mm 50 mm 88 mm
- RS Stock No.:
- 234-2508
- Brand:
- RS PRO
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Subtotal (1 unit)*
$17.65
(exc. GST)
$19.42
(inc. GST)
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In Stock
- Plus 2 unit(s) shipping from 02 February 2026
- Plus 49 unit(s) shipping from 02 February 2026
- Plus 80 unit(s) shipping from 03 February 2026
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Units | Per unit |
|---|---|
| 1 - 99 | $17.65 |
| 100 - 249 | $17.33 |
| 250 - 499 | $17.01 |
| 500 + | $16.68 |
*price indicative
- RS Stock No.:
- 234-2508
- Brand:
- RS PRO
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | RS PRO | |
| For Use With | Universal Rectangular Alu | |
| Product Type | Heatsink | |
| Length | 50mm | |
| Width | 88 mm | |
| Height | 25mm | |
| Fastening | Screw | |
| Thermal Resistance | 2.5kΩ/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Standards/Approvals | RoHS | |
| Application | High Power Semiconductor Device, Optoelectronic Device | |
| Material | Aluminium | |
| Select all | ||
|---|---|---|
Brand RS PRO | ||
For Use With Universal Rectangular Alu | ||
Product Type Heatsink | ||
Length 50mm | ||
Width 88 mm | ||
Height 25mm | ||
Fastening Screw | ||
Thermal Resistance 2.5kΩ/W | ||
Colour Black | ||
Finish Black Anodised | ||
Standards/Approvals RoHS | ||
Application High Power Semiconductor Device, Optoelectronic Device | ||
Material Aluminium | ||
- COO (Country of Origin):
- GB
Low Profile Non-standard Extrusion With Channel
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
Note
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Pre-drilled to take 1 off TO3 metal can semiconuctor package.