STMicroelectronics Surface Mount Chip Balun
- RS Stock No.:
- 190-6833
- Mfr. Part No.:
- EMIF03-SIM02M8
- Brand:
- STMicroelectronics
This image is representative of the product range
Subtotal (1 pack of 25 units)*
$13.075
(exc. GST)
$14.375
(inc. GST)
FREE delivery for orders over $60.00 ex GST
In Stock
- 2,500 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 25 + | $0.523 | $13.08 |
*price indicative
- RS Stock No.:
- 190-6833
- Mfr. Part No.:
- EMIF03-SIM02M8
- Brand:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Chip Balun | |
| Mount Type | Surface Mount | |
| Pin Count | 8 | |
| Maximum Frequency | 3.0GHz | |
| Minimum Frequency | 300kHz | |
| Minimum Operating Temperature | -40°C | |
| Package Type | Micro QFN | |
| Maximum Operating Temperature | 85°C | |
| Length | 1.7mm | |
| Height | 0.6mm | |
| Standards/Approvals | UL94 V0, JEDEC JESD97, IEC 61000-4-2, MIL STD 883G | |
| Width | 1.5mm | |
| Series | EMIF03-SIM02M8 | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Chip Balun | ||
Mount Type Surface Mount | ||
Pin Count 8 | ||
Maximum Frequency 3.0GHz | ||
Minimum Frequency 300kHz | ||
Minimum Operating Temperature -40°C | ||
Package Type Micro QFN | ||
Maximum Operating Temperature 85°C | ||
Length 1.7mm | ||
Height 0.6mm | ||
Standards/Approvals UL94 V0, JEDEC JESD97, IEC 61000-4-2, MIL STD 883G | ||
Width 1.5mm | ||
Series EMIF03-SIM02M8 | ||
The STMicroelectronics EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external pins.
High reduction of parasitic elements through integration and wafer level packaging
High reliability offered by monolithic integration
SIM card EMI low-pass filter
Very low PCB space consumption 1.7 mm x 1.5 mm
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