Silicon Labs EFR32FG25A211F1920IM56-B RF Transceiver IC, 56-Pin QFN-56
- RS Stock No.:
- 270-0505P
- Mfr. Part No.:
- EFR32FG25A211F1920IM56-B
- Brand:
- Silicon Labs
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Units | Per unit | Saving |
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| 10 - 24 | $17.10 | - |
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| 100 + | $14.42 | 15% |
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- RS Stock No.:
- 270-0505P
- Mfr. Part No.:
- EFR32FG25A211F1920IM56-B
- Brand:
- Silicon Labs
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Silicon Labs | |
| Technology | ARM Cortex | |
| Product Type | RF Transceiver IC | |
| Modulation Technique | FSK | |
| Sub Type | Sub-GHz Wireless SoC | |
| Data Rate | 2530kHz | |
| Package Type | QFN-56 | |
| Pin Count | 56 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 470MHz | |
| Operating Band 2 Frequency | 920MHz | |
| Minimum Supply Voltage | 1.71V | |
| Maximum Supply Voltage | 3.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Series | EFR32FG25 | |
| Number of Operating Bands | 2 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Silicon Labs | ||
Technology ARM Cortex | ||
Product Type RF Transceiver IC | ||
Modulation Technique FSK | ||
Sub Type Sub-GHz Wireless SoC | ||
Data Rate 2530kHz | ||
Package Type QFN-56 | ||
Pin Count 56 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 470MHz | ||
Operating Band 2 Frequency 920MHz | ||
Minimum Supply Voltage 1.71V | ||
Maximum Supply Voltage 3.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
Series EFR32FG25 | ||
Number of Operating Bands 2 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- TW
The Silicon Labs EFR32FG25 gecko SoC is an Ideal solution for sub-GHz Wi-SUN applications for metering, lighting, and distribution automation. The high-performance sub-GHz radio provides long range and is not susceptible to 2.4 GHz interference from technologies like Wi-Fi. The single die, multi-core solution, provides industry leading security, high throughput, and an integrated power amplifier to enable the next level of secure connectivity for IoT devices.
Integrated PA with up to 16 dBm (SubGHz) TX power
Robust peripheral set and up to 37 GPIO
Operation up to 125 °C