Samtec SEAF Series Straight Surface PCB Socket, 400-Contact, 10 Row, 1.27 mm Pitch Solder
- RS Stock No.:
- 180-2444
- Mfr. Part No.:
- SEAF-40-05.0-L-10-2-A-K-TR
- Brand:
- Samtec
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$9,854.25
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- RS Stock No.:
- 180-2444
- Mfr. Part No.:
- SEAF-40-05.0-L-10-2-A-K-TR
- Brand:
- Samtec
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 400 | |
| Number of Rows | 10 | |
| Sub Type | High Speed High Density Open-Pin-Field Array Socket | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 18.5mm | |
| Connector System | Board-to-Board | |
| Voltage | 240V | |
| Series | SEAF | |
| Row Pitch | 2.5mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 400 | ||
Number of Rows 10 | ||
Sub Type High Speed High Density Open-Pin-Field Array Socket | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 18.5mm | ||
Connector System Board-to-Board | ||
Voltage 240V | ||
Series SEAF | ||
Row Pitch 2.5mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
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