Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 670-2143P
- Mfr. Part No.:
- 43650-0313
- Brand:
- Molex
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- RS Stock No.:
- 670-2143P
- Mfr. Part No.:
- 43650-0313
- Brand:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit 3.0 | |
| Pitch | 3mm | |
| Current | 5A | |
| Number of Contacts | 3 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series Micro-Fit 3.0 | ||
Pitch 3mm | ||
Current 5A | ||
Number of Contacts 3 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 250V | ||
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Features and Benefits
• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Solder tabs for secure connection to PCB
• Glow Wire Compliant
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals