Amphenol Communications Solutions Bergstik Series Vertical Surface Pin Header, 20 Contact(s), 2.54 mm Pitch, 2 Row,
- RS Stock No.:
- 236-4713
- Mfr. Part No.:
- 95278-101A20LF
- Brand:
- Amphenol Communications Solutions
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 236-4713
- Mfr. Part No.:
- 95278-101A20LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Series | Bergstik | |
| Product Type | Pin Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Minimum Operating Temperature | -65°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 1500 V | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Series Bergstik | ||
Product Type Pin Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Thermoplastic | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Minimum Operating Temperature -65°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 1500 V | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Related links
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- Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header 2.54 mm Pitch
- Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header 2.54 mm Pitch
- Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header 2.54 mm Pitch
- Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header 2.54 mm Pitch
- Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header 2.54 mm Pitch
