- RS Stock No.:
- 220-7418
- Mfr. Part No.:
- IPDD60R080G7XTMA1
- Brand:
- Infineon
Available for back order.
Price (ex. GST) Each (In a Pack of 2)
$11.105
(exc. GST)
$12.215
(inc. GST)
Units | Per unit | Per Pack* |
---|---|---|
2 - 424 | $11.105 | $22.21 |
426 - 848 | $10.825 | $21.65 |
850 + | $10.66 | $21.32 |
*price indicative
- RS Stock No.:
- 220-7418
- Mfr. Part No.:
- IPDD60R080G7XTMA1
- Brand:
- Infineon
Technical data sheets
Legislation and Compliance
Product Details
The Infineon technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600V Cool MOS G7 super junction (SJ) MOSFETis combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
Innovative top-side cooling concept
Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e efficiency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
Innovative top-side cooling concept
Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e efficiency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Specifications
Attribute | Value |
---|---|
Channel Type | N |
Maximum Continuous Drain Current | 83 A |
Maximum Drain Source Voltage | 650 V |
Package Type | DDPAK |
Series | CoolMOS™ G7 |
Mounting Type | Surface Mount |
Pin Count | 10 |
Maximum Drain Source Resistance | 0.08 O |
Channel Mode | Enhancement |
Maximum Gate Threshold Voltage | 4V |
Number of Elements per Chip | 2 |
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