Infineon, 32 bit TriCore, TriCore Microcontroller, 200 MHz, 2.048MB FLASH, 100-Pin TQFP
- RS Stock No.:
- 229-1879P
- Mfr. Part No.:
- TC233LP32F200NACKXUMA1
- Brand:
- Infineon
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- RS Stock No.:
- 229-1879P
- Mfr. Part No.:
- TC233LP32F200NACKXUMA1
- Brand:
- Infineon
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Microcontroller | |
| Series | TriCore | |
| Package Type | TQFP | |
| Mount Type | Surface | |
| Pin Count | 100 | |
| Device Core | TriCore | |
| Data Bus Width | 32bit | |
| Program Memory Size | 2.048MB | |
| Interface Type | LIN, CAN, SPI | |
| Maximum Clock Frequency | 200MHz | |
| RAM Size | 192kB | |
| Maximum Supply Voltage | 3.3V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Power Dissipation Pd | 460mW | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | ISO 26262, AUTOSAR V3.2 and V4.x | |
| Height | 1.2mm | |
| Length | 14mm | |
| Width | 14mm | |
| Minimum Supply Voltage | 0mV | |
| Number of Timers | 1 | |
| ADCs | 24 x 12 Bit | |
| Automotive Standard | ISO 26262 | |
| Program Memory Type | FLASH | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Microcontroller | ||
Series TriCore | ||
Package Type TQFP | ||
Mount Type Surface | ||
Pin Count 100 | ||
Device Core TriCore | ||
Data Bus Width 32bit | ||
Program Memory Size 2.048MB | ||
Interface Type LIN, CAN, SPI | ||
Maximum Clock Frequency 200MHz | ||
RAM Size 192kB | ||
Maximum Supply Voltage 3.3V | ||
Minimum Operating Temperature -40°C | ||
Maximum Power Dissipation Pd 460mW | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals ISO 26262, AUTOSAR V3.2 and V4.x | ||
Height 1.2mm | ||
Length 14mm | ||
Width 14mm | ||
Minimum Supply Voltage 0mV | ||
Number of Timers 1 | ||
ADCs 24 x 12 Bit | ||
Automotive Standard ISO 26262 | ||
Program Memory Type FLASH | ||
Infineon AURIXTM Series Microcontroller, 200MHz Maximum Clock Frequency, 2MB Program Memory Size - TC233LP32F200NACKXUMA1
Features and Benefits:
• 2MB flash programme memory enables extensive firmware storage
• 192kB RAM supports complex runtime data and buffering
• LIN CAN SPI interfaces facilitate multi-network communications
• 24x12bit ADC channels provide fine-grained analogue sampling
• 460mW maximum dissipation reduces thermal load in assemblies
Applications
• Ideal for powertrain and body control modules with vehicle networks
• Used for data acquisition tasks utilising multiple ADC channels
• Can be used in systems requiring AUTOSAR compliance support
• Used with designs needing operation from -40 to125°C
What package type does it use for PCB assembly?
Which supply voltage and bus width does it require?
What timers and peripheral resources are available?
How does it meet automotive software integration standards?
What operational temperature and power constraints should be considered?
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