SPREADFAST Heatsink, Universal Square Ceramic, 12.7°C/W, 24 °C/W 10 mm 23 mm 23 mm
- RS Stock No.:
- 123-5633
- Mfr. Part No.:
- SF-CHS-232310-PC
- Brand:
- SPREADFAST
Currently unavailable
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- RS Stock No.:
- 123-5633
- Mfr. Part No.:
- SF-CHS-232310-PC
- Brand:
- SPREADFAST
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 23mm | |
| Width | 23 mm | |
| Height | 10mm | |
| Thermal Resistance | 12.7, 24°C/W | |
| Fastening | Adhesive, Screw | |
| Colour | White | |
| Series | Circular Pin Fin | |
| Standards/Approvals | RoHS | |
| Material | Aluminium Oxide | |
| Special Features | Lower Density (When Compared With Metal Heat Sink Varieties), Good Heat Spreader, High Volume Resistivity, High Breakdown Voltage, Ideal for Direct Metalisation, Good Thermal Cycling Stability, Good EMC | |
| Select all | ||
|---|---|---|
Brand SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 23mm | ||
Width 23 mm | ||
Height 10mm | ||
Thermal Resistance 12.7, 24°C/W | ||
Fastening Adhesive, Screw | ||
Colour White | ||
Series Circular Pin Fin | ||
Standards/Approvals RoHS | ||
Material Aluminium Oxide | ||
Special Features Lower Density (When Compared With Metal Heat Sink Varieties), Good Heat Spreader, High Volume Resistivity, High Breakdown Voltage, Ideal for Direct Metalisation, Good Thermal Cycling Stability, Good EMC | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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