Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

Select all	Attribute	Value
	Brand	Bergquist
	Thickness	0.001in
	Thermal Conductivity	1.5W/m·K
	Material	Hi-Flow 650P
	Self-Adhesive	Yes
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	+150°C
	Material Trade Name	Hi-Flow 650P
	Operating Temperature Range	-40 → +150 °C

	Select all
	Brand Bergquist
	Thickness 0.001in
	Thermal Conductivity 1.5W/m·K
	Material Hi-Flow 650P
	Self-Adhesive Yes
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature +150°C
	Material Trade Name Hi-Flow 650P
	Operating Temperature Range -40 → +150 °C

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

Hi-Flow 650P