Taiyo Yuden 1μF MLCC, 6.3V dc V, ±20% , SMD

Monolithic structure provides higher reliability. A wide range of capacitance values available in standard case sizes. The use of nickel as electrode material and plating processing improve the solderability and heat resistance characteristics. It also prevents migration and raises the level of reliability. Low equivalent series resistance(ESR) provides superior noise absorption characteristics.

Item Summary 1 μF ± 20%, 6.3V, X5R, 0201/0603
Life cycle Stage Mass Production
Standard packaging quantity (minimum) Taping paper 15000pcs
Applications
Communication equipment (cellular phone, wireless applications, etc.)
General digital circuit
Power supply bypass capacitors: Liquid crystal modules, Liquid crystal drive voltage lines, LSI, IC, converters (both for input and output)
Smoothing capacitors: DC-DC converters (for both input and output), Switching power supplies (secondary side)

0201 Range

Nickel barrier terminations covered with a layer of plated Tin (NiSn)
Applications include mobile phones, video and tuner designs
C0G/NP0 is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials
X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials
Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.