FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
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1206 Range
C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
