Heatsink, BGA, 35 x 35 x 25mm, Clip

  • RS Stock No. 489-6120
  • Mfr. Part No. MBH35002-25P/2.6
  • Manufacturer Malico
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): TW
Product Details

BGA Chipset Heat Sinks

High-performance precision-forged clip-attachment heatsinks for BGA chipsets.

AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop

BGA Heatsinks

Specifications
Attribute Value
For Use With Clip
Length 35mm
Width 35mm
Height 25mm
Dimensions 35 x 35 x 25mm
Mounting Clip
Colour Black
On back order for despatch 05/03/2020, delivery within 5 working days from despatch date.
Price (ex. GST) Each
$ 7.71
(exc. GST)
$ 8.48
(inc. GST)
units
Per unit
1 - 49
$7.71
50 - 99
$7.53
100 - 249
$7.34
250 - 499
$7.13
500 +
$6.96
Related Products
A range of BGA heatsinks with thermally conductive ...
Description:
A range of BGA heatsinks with thermally conductive adhesive tape mounting Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin Fin array allows omni-directional airflow to maximize heat dissipation.
Aluminium heatsink solution with plastic clips, and phase ...
Description:
Aluminium heatsink solution with plastic clips, and phase change thermal interface material for heat removal on BGA packages and similar heat sources Low profile Base thickness 1.7mm Black anodised finish Plastic clip for simple attachment to BGAHigh performance phase change ...
Aluminium heatsink solutions suitable for variety of BGA ...
Description:
Aluminium heatsink solutions suitable for variety of BGA packages Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability. Mechanical fixing (variation between heat sinks)Developed for mass production and ...
Aluminium heatsink solutions suitable for variety of BGA ...
Description:
Aluminium heatsink solutions suitable for variety of BGA packages Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability. Mechanical fixing (variation between heat sinks)Developed for mass production and ...