Heatsink, BGA, 6.5K/W, 60.1 x 53 x 35.1mm, Solder

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

CCI Chipset Heatsink

Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.

Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection

BGA Heatsinks

Specifications
Attribute Value
For Use With Universal Square Alu
Length 60.1mm
Width 53mm
Height 35.1mm
Dimensions 60.1 x 53 x 35.1mm
Thermal Resistance 6.5K/W
Mounting Solder
Package Type BGA
5 In stock for delivery within 5 working day(s) (Global Stock)
Price (ex. GST) Each
$ 3.41
(exc. GST)
$ 3.75
(inc. GST)
units
Per unit
1 - 9
$3.41
10 - 24
$3.34
25 - 49
$3.24
50 - 99
$3.16
100 +
$3.08
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