Electrolube Epoxy Thermal Conductive Compound, 48 h Cure, 20 ml Syringe

  • RS Stock No. 155-8320
  • Mfr. Part No. TBS20S
  • Manufacturer Electrolube
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

Electrolube Thermal Bonding System

The TBS (thermal bonding sytsem) from Electrolube is a two part, thermally conductive epoxy system perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital. The Electrolube thermal bonding system features metal oxides that provide high quality thermal conductivity whilst being electrically insulating. This versatile TBS offers a wide operating range of -40°C to + 120°C, allowing you to work with a variety of applications. The two part epoxy system is quick and easy to mix, with a usable life of 3 to 4 hours once mixed and is ideal for room temperature curing if required.

Features and benefits

• Wide operating range of -40°C to +120°C, ideal for use with a variety of applications
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Room temperature curing, with shorter rates achievable at higher temperatures
• Easy to mix blue (A) and cream (B) coloured parts, with a 3:1 (A:B) mixing ratio
• High thermal conductivity: 1.10 W/m.K


Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin. with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:

• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors

How to apply

Before applying, ensure surfaces are clean and free from grease, dust and contaminants. Begin by mixing the two parts of the compound together as per the mix ratio. Once mixed, apply a thin film, to the base and mounting studs of many component types including diodes, transistors, thyristors, heatsinks, silicone rectifiers, semiconductors, thermostats, power resistors and radiators.

Can this thermal adhesive be removed?

Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times.

What is the maximum operating temperature?

The maximum operating temperature of this thermal compound is +120°C.

Attribute Value
Type Thermal Conductive Compound
Product Material Epoxy
Package Type Syringe
Package Size 20 ml
Thermal Conductivity 1.1W/mK
Cure Time 48 h
Maximum Operating Temperature +120°C
Minimum Operating Temperature -40°C
Operating Temperature Range -40 → +120 °C
14 In stock for delivery within 1 working day(s)
Price (ex. GST) Each
$ 33.40
(exc. GST)
$ 36.74
(inc. GST)
Per unit
1 +
Related Products
From RS PRO a high-quality two-part clear amber, ...
From RS PRO a high-quality two-part clear amber, flexible polyurethane encapsulation compound designed to encapsulate and provide protection to your more delicate electronic components from vibration and mechanical and thermal shock and high humidity environments The transparency of this resin ...
Q-Sil 553 is 2-component, addition-cure, thermally conductive silicone ...
Q-Sil 553 is 2-component, addition-cure, thermally conductive silicone elastomer system It has been specially designed for electronic assembly potting applications. The fully cured elastomer offers good protection against shock, vibration and environmental contamination and is UL 94V0 approved. The twin ...
A white, flame retardant, epoxy resin system designed ...
A white, flame retardant, epoxy resin system designed to conduct heat away from 'hot spots' Unlike similar materials this product has relatively low viscosity and gives little risk of abrasion from the fillers. Typical applications include potting temperature sensors, high ...
A dark grey, two-part, flexible encapsulant designed to ...
A dark grey, two-part, flexible encapsulant designed to provide environmental protection whilst not causing component stress by shrinkage during cure,The compound offers a short gel time (75 mins) and no exotherm (heat evolved) problems.In its cured state it is flame ...