Microchip Xplained Pro WINC3400 Bluetooth, Wi-Fi Development Kit for WINC3400-MR210CA Module 20MHz ATWINC3400-XPRO
- RS Stock No.:
- 144-9441
- Mfr. Part No.:
- ATWINC3400-XPRO
- Brand:
- Microchip
- RS Stock No.:
- 144-9441
- Mfr. Part No.:
- ATWINC3400-XPRO
- Brand:
- Microchip
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
The ATWINC3400-XPRO evaluation kit is a hardware platform to evaluate the WINC3400-MR210CA module. The WINC3400 is an IEEE 802.11 b/g/n/BLE4.0 IoT network controller SoC. It is the ideal add-on to existing MCU solutions bringing Wi-Fi and BLE Network capabilities through SPI-to-Wi-Fi interface. The WINC3400 connects to any PIC or SAM MCU with minimal resource requirements. The WINC3400's most advanced mode is a single stream 1x1 802.11n mode providing up to 72 Mbps PHY throughput. The WINC3400 features fully-integrated Power Amplifier, LNA, Switch and Power Management. It also features an on-chip microcontroller and integrated flash memory for system software with built in coexistence mechanism for concurrent Wi-Fi & BLE functionality. The only external clock source needed for the WINC3400 is a high-speed crystal or oscillator running at 26 MHz. The WINC3400 is available in a QFN package or as a fully certified module.
IEEE 802.11: IEEE 802.11 b/g/n 20MHz (1x1) solution
IEEE 802.11: Single spatial stream in 2.4GHz ISM band
IEEE 802.11: Integrated PA and T/R Switch
IEEE 802.11: Superior Sensitivity and Range via advanced PHY signal processing
IEEE 802.11: Operating temperature range of -40C to +85C
IEEE 802.11: On-Chip Network Stack to offload MCU
IEEE 802.11: Integrated Network IP stack to minimize host CPU requirements
IEEE 802.11: Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS
Bluetooth: On-Chip Network Stack to offload MCU
Bluetooth: BLE 4.0
Bluetooth: Class 2 transmission
Bluetooth: Adaptive Frequency Hopping
Bluetooth: Integrated PA and T/R Switch
Bluetooth: Superior Sensitivity and Range
IEEE 802.11: Single spatial stream in 2.4GHz ISM band
IEEE 802.11: Integrated PA and T/R Switch
IEEE 802.11: Superior Sensitivity and Range via advanced PHY signal processing
IEEE 802.11: Operating temperature range of -40C to +85C
IEEE 802.11: On-Chip Network Stack to offload MCU
IEEE 802.11: Integrated Network IP stack to minimize host CPU requirements
IEEE 802.11: Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS
Bluetooth: On-Chip Network Stack to offload MCU
Bluetooth: BLE 4.0
Bluetooth: Class 2 transmission
Bluetooth: Adaptive Frequency Hopping
Bluetooth: Integrated PA and T/R Switch
Bluetooth: Superior Sensitivity and Range
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Specifications
Attribute | Value |
---|---|
RF Technology | Bluetooth, Wi-Fi |
Kit Classification | Development Kit |
For Use With | WINC3400-MR210CA Module |
Featured Device | WINC3400 |
Frequency | 20MHz |
Kit Name | Xplained Pro |