Price (ex. GST) Each
|1 - 4||$33.44|
|5 - 24||$32.77|
- RS Stock No.:
- RS PRO
- COO (Country of Origin):
Legislation and Compliance
- COO (Country of Origin):
General Purpose Twin Pack
A black, flame-retardant, room temperature curing epoxy for potting electrical and electronic components and sub assemblies. The hard, high gloss, jet black finish gives permanent (non repairable) environmental protection. Slight flexibility permits thermal expansion without stress. Low exothermic temperature rise protects components during curing.,Cure time: 6//24 hours @25°C. The compound can be handled after 6 hours but full properties are developed after 24 hours.Cure may be accelerated to 2 hours by baking at 50°C to 100°C. Provides class E insulation. Flammability rating UL94V-0. Compatible with most printed circuit board components and materials including polystyrene capacitors. Non-staining. Choice of pack sizes avoids wastage.
What is Epoxy Resin Potting Compound?
This epoxy resin is a type of electronic potting compound used for encasing or encapsulating PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which protects and insulates them from harsh environments. These harsh environments include moisture, chemicals, vibration, thermal or physical shock and general contamination. The mechanical protection provided by this epoxy compound enables the components to maintain high performance under extreme conditions.
Features and Benefits
High hardness material
Excellent mechanical protection against vibration and physical shock
Good chemical resistance and water resistance
Excellent electrical insulation properties
Adheres to a wide range of substrates
Flame retardant to UL94 V-0 with 'clean' flame retardant technology
Hardener free of DDMs or other aromatic amines
Low shrinkage ratio during curing
Low coefficient of thermal expansion when subject to temperature changes
Mix in the bag twin pack design reduces user contact and mess
What is This Epoxy Resin Potting Compound Used For?
This black epoxy resin is designed to provide protection to electrical components in a general use environment in standard atmospheric conditions. The applications for this cost-effective and versatile compound are diverse and can include PCBs and electronic components in military, industrial, automotive and domestic devices.
Whats in the Pack?
This black epoxy potting compound is supplied in twin pack format. One pack contains the epoxy resin and one contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the epoxy to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.
How do you Apply Potting Compound?
Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called The pot. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called potted PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.
Potting Compounds: Twin Packs
|Package Size||250 g|
|Special Properties||Flame Retardant|
|Cure Time||24 h|
|Hardness||85 Shore D|
|Maximum Operating Temperature||+120°C|
|Minimum Operating Temperature||-40°C|
|Chemical Composition||3 Dimethylbenzene, Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1|
|Operating Temperature Range||-40 → +120 °C|
|Viscosity Measurement||150, 000 mPa/s at +25°C|
|Physical Form||Viscous Liquid|