RS PRO White Chemical Resistance, Water Resistance Epoxy Potting Compound

  • RS Stock No. 552-668
  • Manufacturer RS PRO
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

Thermally Conductive Twin Pack

A white, flame retardant, epoxy resin system designed to conduct heat away from 'hot spots'. Unlike similar materials this product has relatively low viscosity and gives little risk of abrasion from the fillers. Typical applications include potting temperature sensors, high output devices and assemblies. The system's cure produces a very low exotherm and can be accelerated by heating. Cure time: 8//24 hours @ 25°C; ,1 hour @100 C

What is Epoxy Resin Potting Compound?

This epoxy resin is a type of electronic potting compound used for the encapsulation of PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier. This barrier protects and insulates the components from damaging environments including water, chemicals, heat and general contamination allowing them to maintain a high performance.

Features and Benefits

• High thermal conductivity of 1.26W/m.K
• Good chemical resistance and water resistance
• Good environmental protection
• Flame retardant to UL94 V-0 with a 'clean' flame retardant technology
• No abrasive fillers reducing wear on dispensing machinery
• White colour gives an attractive aesthetic finish
• ’Mix in the bag’ twin pack design reduces user contact and mess

What is this Epoxy Resin Potting Compound Used For?

This epoxy potting compound with its high thermal conductivity is ideal for use in thermal management solutions in LED applications as it dissipates heat away from the LED or unit. This compound can be used in both external and internal lighting systems.

What's in the Pack?

This white epoxy potting compound is supplied in twin pack format. One pack contains the epoxy resin and one contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the epoxy to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.

How do you Apply Potting Compound?

Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ’The pot’. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ’potted’ PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.

Potting Compounds: Twin Packs

Attribute Value
Product Material Epoxy
Package Type Pack
Package Size 250 g
Special Properties Chemical Resistance, Water Resistance
Cure Time 24 h
Hardness 80 Shore D
Thermal Conductivity 1.26W/mK
Colour White
Maximum Operating Temperature +130°C
Minimum Operating Temperature -40°C
Chemical Composition [(2Ethylhexyl)Oxy]Methyloxirane, Bis[4-(2, Epoxy Resin, Zinc Oxide, 3-Epoxypropoxy)Phenyl]Propane
Dielectric Strength 10kV/mm
Operating Temperature Range -40 → +130 °C
Physical Form Viscous Liquid
Viscosity Measurement 16700 mPa/s at +23°C
Volume Resistivity 1015Ω cm
4 In stock for delivery within 1 working day(s)
Price (ex. GST) Each
$ 41.18
(exc. GST)
$ 45.30
(inc. GST)
Per unit
1 - 4
5 - 9
10 +
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