Acc Silicones QSIL-553 Grey Thermal Conductivity Silicone Potting Compound

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Q-Sil 553 Silicone Encapsulant Twin Pack Sachet

Q-Sil 553 is 2-component, addition-cure, thermally conductive silicone elastomer system. It has been specially designed for electronic assembly potting applications. The fully cured elastomer offers good protection against shock, vibration and environmental contamination and is UL 94V0 approved. The twin pack sachet provides for fast, clean mixing without the need to weigh or measure the A/B components or use external mixing equipment.

Can be used from -50ºC to +260ºC
UL 94V0 approved
Simple 1:1 mix ratio
Two colours assist mixing
Moderately low viscosity
Long pot life
Fast cure at elevated temperature
Thermally conductive rubber
Non-corrosive
Easily repaired

Approvals

UL 94 V-0

Silicone Compounds - ACC

Specifications
Attribute Value
Product Material Silicone
Package Type Dual Cartridge
Package Size 250 g
Special Properties Thermal Conductivity
Cure Time 24 h
Hardness 32 Shore A
Thermal Conductivity 0.68W/mK
Colour Grey
Maximum Operating Temperature +260°C
Minimum Operating Temperature -55°C
Operating Temperature Range -55 → +260 °C
7 : Next working day (AU stock)
94 : 5 working days (Global stock)
Price (ex. GST) Each
$ 110.48
(exc. GST)
$ 121.53
(inc. GST)
units
Per unit
1 - 5
$110.48
6 - 11
$107.18
12 +
$104.88
Related Products
Two part polyurethane resin potting and encapsulating compound ...
Description:
Two part polyurethane resin potting and encapsulating compound supplied in handy 250g ’duo-sachet’ pack for easy mixing and pouring with no mess. Quick setting, flame retardant and thermally conductive encapsulant designed for general purpose use. The cured product is particularly ...
A white, flame retardant, epoxy resin system designed ...
Description:
A white, flame retardant, epoxy resin system designed to conduct heat away from 'hot spots'. Unlike similar materials this product has relatively low viscosity and gives little risk of abrasion from the fillers. Typical applications include potting temperature sensors, high ...
A dark grey, two-part, flexible encapsulant designed to ...
Description:
A dark grey, two-part, flexible encapsulant designed to provide environmental protection whilst not causing component stress by shrinkage during cure.,The compound offers a short gel time (75 mins) and no exotherm (heat evolved) problems.In its cured state it is flame ...
A black, flame-retardant, room temperature curing epoxy for ...
Description:
A black, flame-retardant, room temperature curing epoxy for potting electrical and electronic components and sub assemblies. The hard, high gloss, jet black finish gives permanent (non repairable) environmental protection. Slight flexibility permits thermal expansion without stress. Low exothermic temperature rise ...