IRLB8743PBF N-Channel MOSFET, 150 A, 30 V HEXFET, 3-Pin TO-220AB Infineon

  • RS Stock No. 913-4045
  • Mfr. Part No. IRLB8743PBF
  • Manufacturer Infineon
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): MX
Product Details

N-Channel Power MOSFET 30V, Infineon

The Infineon range of discrete HEXFET® power MOSFETs includes N-channel devices in surface mount and leaded packages. And form factors that can address almost any board layout and thermal design challenge. Across the range benchmark on resistance drives down conduction losses, allowing designers to deliver optimum system efficiency.

MOSFET Transistors, Infineon

Infineon offers a large and comprehensive portfolio of MOSFET devices which includes the CoolMOS, OptiMOS and StrongIRFET families. They deliver best-in-class performance to bring more efficiency, power density and cost effectiveness. Designs requiring high quality and enhanced protection features benefit from AEC-Q101 industry standards Automotive qualified MOSFETs.

Specifications
Attribute Value
Channel Type N
Maximum Continuous Drain Current 150 A
Maximum Drain Source Voltage 30 V
Package Type TO-220AB
Mounting Type Through Hole
Pin Count 3
Maximum Drain Source Resistance 3 mΩ
Channel Mode Enhancement
Maximum Gate Threshold Voltage 2.35V
Minimum Gate Threshold Voltage 1.35V
Maximum Power Dissipation 140 W
Transistor Configuration Single
Maximum Gate Source Voltage -20 V, +20 V
Number of Elements per Chip 1
Width 4.83mm
Length 10.67mm
Transistor Material Si
Minimum Operating Temperature -55 °C
Typical Gate Charge @ Vgs 36 nC @ 4.5 V
Height 9.02mm
Series HEXFET
Maximum Operating Temperature +175 °C
300 In stock for delivery within 5 working day(s) (Global Stock)
Price (ex. GST) Each (In a Tube of 50)
$ 1.71
(exc. GST)
$ 1.88
(inc. GST)
units
Per unit
Per Tube*
50 - 50
$1.71
$85.50
100 - 150
$1.32
$66.00
200 - 450
$1.294
$64.70
500 - 950
$1.17
$58.50
1000 +
$0.922
$46.10
*price indicative
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The Infineon range of discrete HEXFET® power MOSFETs includes N-channel devices in surface mount and leaded packages And form factors that can address almost any board layout and thermal design challenge. Across the range benchmark on resistance drives down conduction ...