Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm

RS Stock No.:: 200-5498
Mfr. Part No.:: 35310105 BOP 10.1 S
Brand:: Bopla

Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm

On back order for despatch 24/06/2024, delivery within 10 working days from despatch date.

Added

Price (ex. GST) Each

$47.01

(exc. GST)

$51.71

(inc. GST)

Units	Per unit
1 - 9	$47.01
10 - 24	$45.69
25 +	$44.47

RS Stock No.:: 200-5498
Mfr. Part No.:: 35310105 BOP 10.1 S
Brand:: Bopla

Technical data sheets

Legislation and Compliance

Product Details

The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.

IP65 rating
UL 94 V0 Fire class
Design seal optional

Specifications

Attribute	Value
Type	Seal
Length	291mm
For Use With	BoPad 10.1 Enclosures
Width	204mm
Dimensions	291 x 204 x 54.3mm
Height	54mm
Series	BoLink

Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm

Technical data sheets

Legislation and Compliance

Product Details

Specifications

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