RS PRO Liquid Adhesive, 10 ml

Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.

We recommend using a dispenser needle with this product. See below for compatible needles.

• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.

General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786

Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.

How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.

RS PRO

RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.