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A clear low melt adhesive suitable for bonding ...
Description:
A clear low melt adhesive suitable for bonding a wide range of substrates, without the fear of heat damage on heat sensitive surfaces. The adhesive has a working time of 35 seconds from applicationThe adhesive is supplied in a bag ...
The overtec system is a low-pressure moulding process ...
Description:
The overtec system is a low-pressure moulding process that uses thermoplastic moulding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection moulding. A process innovation positioned ...
Electric gun for professional use, capable of operating ...
Description:
Electric gun for professional use, capable of operating for one day without interruption.Equipped with a trigger for moving the glue stick forward.Uses solvent-free hot melt adhesives that bond most plastics, metals, glass etc.Typical applications: ref. 3738TE universal glue for all ...
Low Viscosity: Typical uses - wire staking, cable ...
Description:
Low Viscosity: Typical uses - wire staking, cable terminal encapsulation. Excellent gap filling performanceLow temperature flexibilityShock and heat resistanceEasy to apply and fast fixingUL94V-0 Rating.