Amphenol Communications Solutions 400 Way SMT BGA Prototyping IC Socket
- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
On back order for despatch 13/08/2024, delivery within 10 working days from despatch date.
Added
Price (ex. GST) Each (On a Reel of 250)
$40.022
(exc. GST)
$44.024
(inc. GST)
| Units | Per unit | Per Reel* |
| 250 - 250 | $40.022 | $10,005.50 |
| 500 - 750 | $39.022 | $9,755.50 |
| 1000 + | $38.421 | $9,605.25 |
| *price indicative | ||
Alternative
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- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Specifications
Attribute | Value |
|---|---|
| Package Type | BGA |
| IC Socket Type | Prototyping Socket |
| Gender | Female |
| Number of Contacts | 400 |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Current Rating | 450.0mA |
| Socket Mounting Type | Surface Mount |
| Device Mounting Type | Surface Mount |
| Voltage Rating | 200.0 V |
| Termination Method | Through Hole |
| Housing Material | Liquid Crystal Polymer |